Integrated Assemblies Comprising Sense-Amplifier-Circuitry and Wordline-Driver-Circuitry Under Memory Cells of a Memory Array

ABSTRACT

Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

TECHNICAL FIELD

Memory arrays (e.g., DRAM arrays). Integrated assemblies comprisingvertically-stacked decks. Integrated assemblies havingsense-amplifier-circuitry and wordline-driver-circuitry under memorycells of a memory array.

BACKGROUND

Memory is utilized in modern computing architectures for storing data.One type of memory is Dynamic Random-Access Memory (DRAM). DRAM mayprovide advantages of structural simplicity, low cost and high speed incomparison to alternative types of memory.

DRAM may utilize memory cells which have one capacitor in combinationwith one transistor (so-called 1T-1C memory cells), with the capacitorbeing coupled with a source/drain region of the transistor. An example1T-1C memory cell 2 is shown in FIG. 1, with the transistor labeled Tand the capacitor labeled C. The capacitor has one node coupled with asource/drain region of the transistor, and another node coupled with acommon plate, CP. The common plate may be coupled with any suitablevoltage, such as a voltage within a range of from greater than or equalto ground to less than or equal to VCC (i.e., ground≤CP≤VCC). In someapplications, the common plate is at a voltage of about one-half VCC(i.e., about VCC/2). The transistor has a gate coupled to a wordline WL(i.e., access line), and has a source/drain region coupled to a bitlineBL (i.e., digit line or sense line). In operation, an electrical fieldgenerated by voltage along the wordline may gatedly couple the bitlineto the capacitor during read/write operations.

Another prior art 1T-1C memory cell configuration is shown in FIG. 2.The configuration of FIG. 2 shows two memory cells 2 a and 2 b; with thememory cell 2 a comprising a transistor T1 and a capacitor C1, and withthe memory cell 2 b comprising a transistor T2 and a capacitor C2.Wordlines WL0 and WL1 are electrically coupled with the gates oftransistors T1 and T2, respectively. A connection to a bitline BL isshared by the memory cells 2 a and 2 b.

The memory cells described above may be incorporated into memory arrays,and in some applications the memory arrays may have open bitlinearrangements. An example integrated assembly 9 having open bitlinearchitecture is shown in FIG. 3. The assembly 9 includes two laterallyadjacent memory arrays (“ARRAY-1” and “ARRAY-2”), with each of thearrays including memory cells of the type described in FIG. 2 (notlabeled in FIG. 3 in order to simplify the drawing). Wordlines WL0-WL7extend across the arrays, and are coupled with wordline drivers. Digitlines D0-D8 are associated with the first array (ARRAY-1), and digitlines D0*-D8* are associated with the second array (ARRAY-2). Senseamplifiers SAO-SA8 are provided between the first and second arrays.Digit lines at the same height are paired within one another andcompared through a sense amplifier (e.g., digit lines D0 and D0* arepaired with one another and compared with the sense amplifier SAO). In aread operation, one of the paired digit lines may serve as a referencein determining electrical properties (e.g., voltage) of the other of thepaired digit lines.

A continuing goal of integrated circuit fabrication is to increasepacking density and to thereby increase the level of integration. Itwould be desirable to develop three-dimensional arrangements havingtightly packed memory.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a prior art memory cell having 1transistor and 1 capacitor.

FIG. 2 is a schematic diagram of a pair of prior art memory cells whicheach have 1 transistor and 1 capacitor, and which share a bitlineconnection.

FIG. 3 is a schematic diagram of a prior art integrated assembly havingopen bitline architecture.

FIG. 4 is a schematic diagram of an example integrated assembly havingmultiple decks which are vertically displaced relative to one another.

FIG. 5 is diagrammatic top-down view of a layout of an examplearrangement of sense-amplifier-circuitry and wordline-driver-circuitry.

FIGS. 6A and 6B are diagrammatic side views of an examplemulti-deck-assembly showing example arrangements of circuit components.

FIGS. 7A and 7B are diagrammatic side views of an examplemulti-deck-assembly showing example arrangements of circuit components.

FIGS. 8A and 8B are diagrammatic side views of an examplemulti-deck-assembly showing example arrangements of circuit components.

FIG. 9 is a diagrammatic schematic diagram of examplesense-amplifier-circuitry.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Some embodiments include integrated assemblies in which first and secondmemory arrays are laterally adjacent to one another and extend alongmultiple decks of a multi-deck-assembly, and in whichsense-amplifier-circuitry and wordline-driver-circuitry is providedunder the first and second memory arrays. The sense-amplifier-circuitrymay be broken amongst multiple blocks (subunits) under the first andsecond memory arrays, and similarly the wordline-driver-circuitry may bebroken amongst multiple blocks (subunits) under the first and secondmemory arrays. The blocks (subunits) of the sense-amplifier-circuitryand the wordline-driver-circuitry may be considered to form a quiltpattern under the first and second memory arrays. Example embodimentsare described with reference to FIGS. 4, 5, 6A, 6B, 7A, 7B, 8A, 8B and9.

Referring to FIG. 4, an integrated assembly 10 includes a base 12, afirst deck 14 over the base, and a second deck 16 over the first deck.The structures 12, 14 and 16 are vertically stacked one atop another.The base 12, first deck 14 and second deck 16 may be considered to beexamples of levels that are stacked one atop the other. The levels maybe within different semiconductor dies, or at least two of the levelsmay be within the same semiconductor die.

The first and second decks 14 and 16 have memory regions 18 and 22,respectively. First and second memory arrays (ARRAY-1 and ARRAY-2) aresupported by the first and second decks 14 and 16, with each of thememory arrays having a first portion along the first (lower) deck 14 anda second portion along the second (upper) deck 16. The first memoryarray includes first memory cells (MC) 20 a, and the second memory arrayincludes second memory cells (MC) 20 b. The memory cells arediagrammatically illustrated as circles. Only some of the first andsecond memory cells are labeled. The first and second memory arrays maycomprise any suitable number of memory cells, and in some embodimentsmay comprise hundreds, thousands, millions, etc., of memory cells. Thememory cells MC may be DRAM cells, and in some embodiments may beconfigured in arrangements of the types described above with referenceto prior art FIGS. 1-3 (i.e., ARRAY-1 and ARRAY-2 may be DRAM arrays).

In some embodiments, the first and second decks 14 and 16 may bereferred to as first and second memory decks, respectively.

The base 12 may comprise semiconductor material; and may, for example,comprise, consist essentially of, or consist of monocrystalline silicon.The base 12 may be referred to as a semiconductor substrate. The term“semiconductor substrate” means any construction comprisingsemiconductive material, including, but not limited to, bulksemiconductive materials such as a semiconductive wafer (either alone orin assemblies comprising other materials), and semiconductive materiallayers (either alone or in assemblies comprising other materials). Theterm “substrate” refers to any supporting structure, including, but notlimited to, the semiconductor substrates described above. In someapplications, the base 12 may correspond to a semiconductor substratecontaining one or more materials associated with integrated circuitfabrication. Such materials may include, for example, one or more ofrefractory metal materials, barrier materials, diffusion materials,insulator materials, etc. Each of the decks 14 and 16 may also comprisesemiconductor material.

In the shown embodiment, the base 12 comprises sense-amplifier-circuitry(SA), and wordline-driver-circuitry (WD).

The sense-amplifier-circuitry includes regions labeled “SA-E” toidentify them as being associated with an “even” portion of a circuit,and regions labeled “SA-0” to identify them as being associated with an“odd” portion of a circuit. The terms “even” and “odd” are arbitrary,and are utilized to distinguish the differentsense-amplifier-circuitries from one another. The illustratedconfiguration has the sense-amplifier-circuitries SA-O and SA-E pairedwith one another and distributed as structures 24. The structures 24 arespread across the base 16, with the two illustrated structures 24 beingspaced-apart from one another. In the shown embodiment, the twoillustrated structures 24 are laterally disposed (horizontally offset)relative to one another. The distribution of thesense-amplifier-circuitries SA-O and SA-E within the structures 24 canenable the sense-amplifier-circuitries to be located directly under thememory cells MC of ARRAY-1 and ARRAY-2, and can leave room under thearrays for the wordline-driver-circuitry. Although thesense-amplifier-circuitries SA-O and SA-E are shown distributed amongsttwo structures 24, in the other embodiments thesense-amplifier-circuitries SA-O and SA-E may be distributed amongst adifferent number of the structures 24 than the illustrated twostructures (e.g., three or more of the structures 24).

In some embodiments, one of the sense-amplifier-circuitries SA-O andSA-E may be referred to as a first sense-amplifier-circuitry and theother may be referred to as a second sense-amplifier-circuitry. Thefirst and second sense-amplifier-circuitries are laterally displacedrelative to one another, and are together incorporated into thestructures 24. In some embodiments, the structures 24 may be consideredto be paired-block arrangements which comprise first blocks 26corresponding to the SA-E circuitry, and which comprise second blocks 28corresponding to the SA-O circuitry.

The wordline-driver-circuitry (i.e., row-driver circuitry) includesregions labeled SWD-E1, SWD-E2, SWD-O1 and SWD-O2. The acronym SWDstands for sub-wordline-driver, and is utilized to emphasize that thecomponents SWD-E1, SWD-E2, SWD-O1 and SWD-O2 are portions of the generalwordline-driver-circuitry. The wordline-driver-circuitries SWD-E1 andSWD-E2 are together utilized during operation of the memory cells (MC)associated with the “even” circuits coupled with SA-E; and thewordline-driver-circuitries SWD-O1 and SWD-O2 are together utilizedduring operation of the memory cells (MC) associated with the “odd”circuits coupled with SA-O. In some embodiments, thewordline-driver-circuitries SWD-E1 and SWD-E2 may be considered to becomprised by a first wordline-driver-circuitry (the circuitry utilizedto drive the “even” circuits), and the wordline-driver-circuitriesSWD-O1 and SWD-O2 may be considered to be comprised by a secondwordline-driver-circuitry (the circuitry utilized to drive the “odd”circuits).

In some embodiments, the wordline-driver-circuitries SWD-E1 and SWD-E2may be considered to correspond to third blocks 30 (with SWD-E1 beinglabeled 30 a and SWD-E2 being labeled 30 b so that they may bedistinguished relative to one another); and thewordline-driver-circuitries SWD-O1 and SWD-O2 may be considered tocorrespond to fourth blocks 32 (with the SWD-O1 being labeled 32 a andSWD-O2 being labeled 32 b so that they may be distinguished relative toone another). The third and fourth blocks 30 and 32 are laterallydisplaced relative to one another, and are together incorporated intopaired-block arrangements 34. In the shown embodiment, one of thepaired-block arrangements 34 comprises SWD-E1 and SWD-O1, and the othercomprises SWD-E2 and SWD-O2. In other embodiments, thepaired-block-arrangements 34 may have other combinations of the SWDcircuitries.

The paired-block arrangements 24 and 34 may be referred to as first andsecond paired-block arrangements, respectively, so that they may bedistinguished from one another. In some embodiments, the paired-blockarrangements 24 and 34 may be together considered to be incorporatedinto a quilted pattern 36 which is directly under the memory cells MC ofthe first and second memory arrays (ARRAY-1 and ARRAY-2). The term“quilted pattern” is utilized to indicate that the paired-blockarrangements 24 and 34 are distributed in a substantially repeatingpattern of subunits; with such subunits being analogous to the “blocks”of fabric which are incorporated into some types of quilts.

First digit lines D0, D1 and D2 are associated with the first memoryarray (ARRAY-1). The first digit lines D0, D1 and D2 extend along thefirst memory array (ARRAY-1) and are coupled with first memory cells 20a of the first memory array. The digit lines D0, D1 and D2 are laterallyspaced from one another, and may be representative of a large number ofsubstantially identical digit lines extending across the first memoryarray; with the term “substantially identical” meaning identical towithin reasonable tolerances of fabrication and measurement. The firstdigit lines alternate between even first digit lines and odd first digitlines, with the digit lines D0 and D2 being representative of even firstdigit lines, and the digit line D1 being representative of an odd firstdigit line. The even first digit lines (e.g., D0) are coupled with thefirst sense-amplifier-circuitry 26 (i.e., SA-E), and the odd first digitlines (e.g., D1) are coupled with the second sense-amplifier-circuitry28 (i.e., SA-O). The first digit lines D0, D1 and D2 have first portionsalong the first deck 14, and have second portions along the second deck16.

Second digit lines D0*, D1* and D2* are associated with the secondmemory array (ARRAY-2). The second digit lines D0*. D1* and D2* extendalong the second memory array and are coupled with second memory cells20 b of the second memory array (ARRAY-2). The digit lines D0*, D1* andD2* are laterally spaced from one another, and may be representative ofa large number of substantially identical digit lines extending acrossthe second memory array. The second digit lines alternate between evensecond digit lines and odd second digit lines, with the digit lines D0*and D2* being representative of even second digit lines, and the digitline D1* being representative of an odd second digit line. The evensecond digit lines (e.g., D0*) are coupled with the firstsense-amplifier-circuitry SA-E, and the odd second digit lines (e.g.,D1*) are coupled with the second sense-amplifier-circuitry SA-O. Thesecond digit lines D0*, D1* and D2* have first portions along the firstdeck 14, and have second portions along the second deck 16.

The even first digit lines D0 and D2 are comparatively coupled with theeven second digit lines D0* and D2* through the firstsense-amplifier-circuitry SA-E; and the odd first digit line D1 iscomparatively coupled with the odd second digit line D1* through thesecond sense-amplifier-circuitry SA-O. For purposes of understandingthis disclosure and the claims that follow, a first digit line is“comparatively coupled” with a second digit line through asense-amplifier-circuitry if the sense-amplifier-circuitry is configuredto compare electrical properties (e.g., voltage) of the first and seconddigit lines with one another. FIG. 9 (discussed below) shows examplefirst sense-amplifier-circuitry SA-E, and shows an example applicationin which digit lines D0 and D0* are comparatively coupled through theexample first sense-amplifier-circuitry.

In the illustrated embodiment of FIG. 4, the digit lines D0, D0*, D1,D1*, D2 and D2* are all vertically displaced relative to the first andsecond sense-amplifier-circuitries SA-E and SA-0. Also, the digit linesD0, D0*, D1, D1*, D2 and D2* are all laterally displaced relative to oneanother.

Referring still to FIG. 4, a first set of wordlines extends along thefirst memory array (ARRAY-1). Representative wordlines of such first setare labeled as WL0, WL2, WL16 and WL23. The wordlines WL0 and WL2 arecoupled with the wordline-driver-circuitry SWD-E1, and the wordlinesWL16 and WL23 are coupled with the wordline-driver-circuitry SWD-O1. Asecond set of wordlines extends along the second memory array (ARRAY-2).Representative wordlines of such second set are labeled as WL8, WL14,WL24 and WL26. The wordlines WL8 and WL14 are coupled with thewordline-driver-circuitry SWD-E2, and the wordlines WL24 and WL26 arecoupled with the wordline-driver-circuitry SWD-O2.

In some embodiments, the wordline-driver-circuitries SWD-E1 and SWD-O1may be considered to be comprised by a first wordline-driver-circuitrywhich encompasses the wordline-driver-circuitry associated with thefirst memory array (ARRAY-1), and the wordline-driver-circuitries SWD-E2and SWD-O2 may be considered to be comprised by a secondwordline-driver-circuitry which encompasses thewordline-driver-circuitry associated with the second memory array(ARRAY-2).

Each of the first memory cells 20 a within the first memory array(ARRAY-1) is uniquely addressed by one of the digit lines extendingalong the first memory array (e.g., one of the digit lines D0, D1 andD2), and one of the wordlines extending along the first memory array(e.g., one of the wordlines WL0, WL2, WL16 and WL23). Similarly, each ofthe memory cells 20 b within the second memory array (ARRAY-2) isuniquely addressed by one of the digit lines extending along the secondmemory array (e.g., one of the digit lines D0*, D1* and D2*), and one ofthe wordlines extending along the second memory array (e.g., one of thewordlines WL8, WL14, WL24 and WL26). In some embodiments, the digitlines along the first memory array (ARRAY-1) may be referred to as afirst set of digit lines, while the digit lines along the second memory(ARRAY-2) are referred to as a second set of digit lines; and similarlythe wordlines along the first memory array (ARRAY-1) may be referred toas a first set of wordlines, while the wordlines along the second memory(ARRAY-2) are referred to as a second set of wordlines. Accordingly,each of the memory cells 20 a of ARRAY-1 may be considered to beuniquely addressed utilizing a wordline from the first set of wordlinesin combination with a digit line from the first set of digit lines; andeach of the memory cells 20 b of the ARRAY-2 may be considered to beuniquely addressed utilizing a wordline from the second set of wordlinesin combination with a digit line from the second set of digit lines.

An advantage of the configuration of FIG. 4 is that all of thesense-amplifier-circuitry and all of the wordline-driver-circuitry isprovided directly under the memory arrays (ARRAY-1 and ARRAY-2), whichmay enable tight packing of the memory arrays across a semiconductorsubstrate; or in other words, which may conserve valuable semiconductorreal estate as compared to conventional configurations in which at leastsome of the sense-amplifier-circuitry and/or at least some of thewordline-driver-circuitry is not directly under a memory array. Thevertical stacking of regions of the memory arrays (ARRAY-1 and ARRAY-2)may further conserve valuable semiconductor real estate.

The configuration of FIG. 4 may be representative of multipleconfigurations which are laterally displaced relative to one anotheracross a semiconductor die. For instance, FIG. 5 shows a top-down viewof a region of an example die 40 which has multiple memory arrays (notshown) provided thereover. The die 40 of FIG. 5 may correspond to a basedie of a vertical stack of dies, and in some embodiments may correspondto the base 12 described above with reference to FIG. 4. The base die 40shows an example arrangement of sense-amplifier-circuitries (SA-E andSA-O) and wordline-driver-circuitries (SWD-O and SWD-E), and in someembodiments may be considered to illustrate an example quiltedarrangement of such circuitries.

Example configurations of regions of the first and second memory arrays(ARRAY-1 and ARRAY-2) are described with reference to FIGS. 6A, 6B, 7A,7B, 8A and 8B. The decks 12, 14 and 16 are diagrammatically indicated inFIGS. 6A, 6B, 7A, 7B, 8A and 8B to assist the reader in understandingexemplary vertical stacking of the various circuitries and structuresshown in the figures.

Referring to FIGS. 6A and 6B, the memory cells MC are shown alongelevational levels corresponding to the decks 14 and 16. Each of thememory cells 20 a of ARRAY-1 is uniquely addressed by a digit line (D0or D1) and a wordline (WL0-WL7 and WL16-23). Each of the memory cells 20b of ARRAY-2 is uniquely addressed by a digit line (D0* or D1*) and awordline (WL8-WL15 and WL24-31). The digit lines D0 and D0* arecomparatively coupled to one another through thesense-amplifier-circuitry SA-E, and the digit lines D1 and D1* arecomparatively coupled to one another through thesense-amplifier-circuitry SA-O. Notably, the digit lines DL0 and DL0*are substantially electrically balanced relative to one another byproviding regions of each digit line to be along both the upper andlower decks 14 and 16, and similarly the digit lines DL1 and DL1* aresubstantially electrically balanced relative to one another.

In some embodiments, the wordlines WL0-WL7 and WL16-WL23 may beconsidered to be the first set of wordlines associated with the firstmemory array (ARRAY-1); with the wordlines WL0-WL7 being considered tobe even wordlines coupled with the wordline-driver-circuitry SWD-E1, andthe wordlines WL16-WL23 being considered to be odd wordlines coupledwith the wordline-driver-circuitry SWD-O1. Similarly, the wordlinesWL8-WL15 and WL24-WL31 may be considered the second set of wordlinesassociated with the second memory array (ARRAY-2); with the wordlinesWL8-WL15 being considered to be even wordlines coupled with thewordline-driver-circuitry SWD-E2, and the wordlines WL24-WL31 beingconsidered to be odd wordlines coupled with thewordline-driver-circuitry SWD-O2.

Referring to FIGS. 7A and 7B, the example memory cells 20 a and 20 b ofthe first and second memory arrays (ARRAY-1 and ARRAY-2) are shown inmore detail than in FIGS. 6A and 6B (only some of the memory cells 20 aand 20 b are labeled in FIGS. 7A and 7B). Each of the memory cells 20 aand 20 b includes a transistor T coupled with a capacitor C. Eachcapacitor has a node coupled with a reference voltage 42. The referencevoltage 42 may correspond to the common plate (CP) voltage describedabove with reference to FIG. 1.

The illustrated memory cells 20 a and 20 b of FIGS. 7A and 7B are 1T-1Cmemory cells. In other embodiments, other memory cells may be utilized.The capacitors of the illustrated memory cells 20 a and 20 b are examplestorage elements (charge-storage devices), and in other embodimentsother suitable storage elements (e.g., phase-change devices,conductive-bridging devices, etc.) may be utilized.

Referring to FIGS. 8A and 8B, the example memory cells 20 a and 20 b ofthe first and memory arrays (ARRAY-1 and ARRAY-2) are shown in moredetail than in FIGS. 7A and 7B (only some of the memory cells 20 a and20 b are labeled in FIGS. 8A and 8B). The transistors T are shown tocomprise vertically-extending pillars 50 of semiconductor material 52.The semiconductor material 52 may comprise any suitable composition(s);and in some embodiments may comprise, consist essentially of, or consistof one or more of silicon, germanium, III/V semiconductor material(e.g., gallium phosphide), semiconductor oxide, etc.; with the termIII/V semiconductor material referring to semiconductor materialscomprising elements selected from groups III and V of the periodic table(with groups III and V being old nomenclature, and now being referred toas groups 13 and 15). Source/drain and channel regions (not shown) maybe provided within the pillars 50.

Gate dielectric material 54 is along sidewalls of the pillars 50, andconductive gate material 56 is along the gate dielectric material.

The gate dielectric material 54 may comprise any suitablecomposition(s); and in some embodiments may comprise, consistessentially of, or consist of silicon dioxide.

The conductive gate material 56 may comprise any suitable electricallyconductive composition(s); such as, for example, one or more of variousmetals (e.g., titanium, tungsten, cobalt, nickel, platinum, ruthenium,etc.), metal-containing compositions (e.g., metal silicide, metalnitride, metal carbide, etc.), and/or conductively-doped semiconductormaterials (e.g., conductively-doped silicon, conductively-dopedgermanium, etc.).

The capacitors C comprise first conductive nodes 58, second conductivenodes 60, and insulative material (capacitor dielectric material) 62between the first and second conductive nodes.

The first and second conductive nodes 58 and 60 may comprise anysuitable electrically conductive composition(s); such as, for example,one or more of various metals (e.g., titanium, tungsten, cobalt, nickel,platinum, ruthenium, etc.), metal-containing compositions (e.g., metalsilicide, metal nitride, metal carbide, etc.), and/or conductively-dopedsemiconductor materials (e.g., conductively-doped silicon,conductively-doped germanium, etc.). The first and second conductivenodes may comprise the same composition as one another, or may comprisedifferent compositions relative to one another.

The insulative material 62 may comprise any suitable composition(s), andin some embodiments may comprise, consist essentially of, or consist ofsilicon dioxide.

In the shown embodiment, the lower conductive nodes 58 are configured asupwardly-opening containers. In other embodiments, the lower conductivenodes may have other suitable shapes.

The lower conductive nodes 58 may be referred to as storage nodes, andthe upper conductive nodes 60 may be referred to as plate electrodes. Insome embodiments, the plate electrodes within ARRAY-1 may all be coupledto one another and the plate electrodes within ARRAY-2 may also all becoupled to one another.

The digit lines D0, D0*, D1 and D1* are shown to comprise conductivematerials 64, 66, 68 and 70, respectively. Such conductive materials maycomprise any suitable electrically conductive composition(s); such as,for example, one or more of various metals (e.g., titanium, tungsten,cobalt, nickel, platinum, ruthenium, etc.), metal-containingcompositions (e.g., metal silicide, metal nitride, metal carbide, etc.),and/or conductively-doped semiconductor materials (e.g.,conductively-doped silicon, conductively-doped germanium, etc.). Theconductive materials 64, 66, 68 and 70 may be the same composition asone another in some embodiments, or at least one of the conductivematerials 64, 66, 68 and 70 may differ from at least one other of theconductive materials 64, 66, 68 and 70 in other embodiments.

The sense-amplifier-circuitries SA-E and SA-O may comprise any suitableconfigurations. An example sense-amplifier-circuitry SA-E 26 isdiagrammatically illustrated in FIG. 9. A dashed line 71 is provided toshow an approximate boundary of the sense-amplifier-circuitry. Althoughthe illustrated circuitry is described as being the SA-Esense-amplifier-circuitry 26, it is to be understood that the SA-Osense-amplifier-circuitry 28 (FIG. 4) may comprise an identicalconfiguration as that describe relative to the example configuration ofFIG. 9.

The sense-amplifier-circuitry 26 of FIG. 9 includes a p-sense amplifier80 comprising a pair of cross-coupled pull-up transistors 82 and 84, andincludes an n-sense amplifier 86 comprising a pair of cross-coupledpull-down transistors 88 and 90. The p-sense amplifier 80 is coupledwith active pull-up circuitry (labeled ACT), and the n-sense amplifier86 is coupled with a common node (labeled RNL). The illustratedsense-amplifier-circuitry SA-E is coupled with the digit lines D0 andD0*; or in other words the digit lines D0 and D0* are comparativelycoupled with one another through the illustratedsense-amplifier-circuitry SA-E. In operation, the amplifiers 80 and 86may be utilized together to detect the relative signal voltages of D0and D0*, and to drive the higher signal voltage to VCC while driving thelower signal voltage to ground. Also, inputs and outputs associated withthe sense amplifier (labeled as I/O) may be utilized for exporting dataregarding the relative signal voltages of D0 and D0*, and/or forprogramming memory cells along one or both of D0 and D0*.

The illustrated sense-amplifier-circuitry also has equilibrationcircuitry (labeled EQ) provided therein to balance electrical propertieswithin the sense amplifier. Other circuitry (not shown) may also beprovided within the sense-amplifier-circuitry. Thesense-amplifier-circuitry of FIG. 9 may comprise any suitableconfiguration.

The assemblies and structures discussed above may be utilized withinintegrated circuits (with the term “integrated circuit” meaning anelectronic circuit supported by a semiconductor substrate); and may beincorporated into electronic systems. Such electronic systems may beused in, for example, memory modules, device drivers, power modules,communication modems, processor modules, and application-specificmodules, and may include multilayer, multichip modules. The electronicsystems may be any of a broad range of systems, such as, for example,cameras, wireless devices, displays, chip sets, set top boxes, games,lighting, vehicles, clocks, televisions, cell phones, personalcomputers, automobiles, industrial control systems, aircraft, etc.

Unless specified otherwise, the various materials, substances,compositions, etc. described herein may be formed with any suitablemethodologies, either now known or yet to be developed, including, forexample, atomic layer deposition (ALD), chemical vapor deposition (CVD),physical vapor deposition (PVD), etc.

The terms “dielectric” and “insulative” may be utilized to describematerials having insulative electrical properties. The terms areconsidered synonymous in this disclosure. The utilization of the term“dielectric” in some instances, and the term “insulative” (or“electrically insulative”) in other instances, may be to providelanguage variation within this disclosure to simplify antecedent basiswithin the claims that follow, and is not utilized to indicate anysignificant chemical or electrical differences.

The terms “electrically connected” and “electrically coupled” may bothbe utilized in this disclosure. The terms are considered synonymous. Theutilization of one term in some instances and the other in otherinstances may be to provide language variation within this disclosure tosimplify antecedent basis within the claims that follow.

The particular orientation of the various embodiments in the drawings isfor illustrative purposes only, and the embodiments may be rotatedrelative to the shown orientations in some applications. Thedescriptions provided herein, and the claims that follow, pertain to anystructures that have the described relationships between variousfeatures, regardless of whether the structures are in the particularorientation of the drawings, or are rotated relative to suchorientation.

The cross-sectional views of the accompanying illustrations only showfeatures within the planes of the cross-sections, and do not showmaterials behind the planes of the cross-sections, unless indicatedotherwise, in order to simplify the drawings.

When a structure is referred to above as being “on”, “adjacent” or“against” another structure, it can be directly on the other structureor intervening structures may also be present. In contrast, when astructure is referred to as being “directly on”, “directly adjacent” or“directly against” another structure, there are no interveningstructures present. The terms “directly under”, “directly over”, etc.,do not indicate direct physical contact (unless expressly statedotherwise), but instead indicate upright alignment.

Structures (e.g., layers, materials, etc.) may be referred to as“extending vertically” to indicate that the structures generally extendupwardly from an underlying base (e.g., substrate). Thevertically-extending structures may extend substantially orthogonallyrelative to an upper surface of the base, or not.

Some embodiments include an integrated assembly having a base comprisingsense-amplifier-circuitry, a first deck over the base, and a second deckover the first deck. The first deck includes a first portion of a firstarray of first memory cells, and includes a first portion of a secondarray of second memory cells. The second deck includes a second portionof the first array of the first memory cells, and includes a secondportion of the second array of the second memory cells. A first digitline is associated with the first array, and a second digit line isassociated with the second array. The first and second digit lines arecomparatively coupled with one another through thesense-amplifier-circuitry.

Some embodiments include an integrated assembly having a base comprisinga first sense-amplifier-circuitry and a secondsense-amplifier-circuitry, with the second sense-amplifier-circuitrybeing laterally displaced from the first sense-amplifier-circuitry. Afirst deck is over the base. The first deck comprises a first portion ofa first array of first memory cells, and comprises a first portion of asecond array of second memory cells. A second deck is over the firstdeck. The second deck comprises a second portion of the first array offirst memory cells, and comprises a second portion of the second arrayof second memory cells. First digit lines are associated with the firstarray. The first digit lines alternate between even first digit linesand odd first digit lines. Second digit lines are associated with thesecond array. The second digit lines alternate between even second digitlines and odd second digit lines. Individual of the even first digitlines are comparatively coupled with individual of the even second digitlines through the first sense-amplifier-circuitry. Individual of the oddfirst digit lines are comparatively coupled with individual of the oddsecond digit lines through the second sense-amplifier-circuitry.

Some embodiments include an integrated assembly comprising a firstsense-amplifier-circuitry laterally displaced relative to a secondsense-amplifier-circuitry. First digit lines are vertically displacedrelative to the first and second sense-amplifier-circuitries and extendalong a first memory array. The first digit lines are laterallydisplaced relative to one another and alternate between even first digitlines and odd first digit lines. Second digit lines are verticallydisplaced relative to the first and second sense-amplifier-circuitries,and extend along a second memory array. The second digit lines arelaterally displaced relative to one another and alternate between evensecond digit lines and odd second digit lines. Individual of the evenfirst digit lines are comparatively coupled with individual of the evensecond digit lines through the first sense-amplifier-circuitry.Individual of the odd first digit lines are comparatively coupled withindividual of the odd second digit lines through the secondsense-amplifier-circuitry. A first set of first wordlines extends alongthe first memory array. A second set of second wordlines extends alongthe second memory array. The first wordlines are coupled with firstwordline-driver-circuitry. The second wordlines are coupled with secondwordline-driver-circuitry. The first sense-amplifier-circuitry, thesecond sense-amplifier-circuitry, the first wordline-driver-circuitryand the second wordline-driver-circuitry are directly under the firstand second memory arrays.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1. An integrated assembly, comprising: a base comprisingsense-amplifier-circuitry and wordline-driver circuitry, the senseamplifier comprised by the base comprising a first block ofsense-amplifier-circuitry and a second block ofsense-amplifier-circuitry that is laterally displaced relative to thefirst block of sense-amplifier-circuitry, the wordline-driver-circuitrycomprising a first wordline-driver-circuitry comprising first pairedspaced-apart blocks and a second wordline-driver-circuitry comprisingsecond paired spaced apart blocks; a first deck over the base; the firstdeck comprising a first portion of a first array of first memory cells,and comprising a first portion of a second array of second memory cells;a second deck over the first deck; the second deck comprising a secondportion of the first array of the first memory cells, and comprising asecond portion of the second array of the second memory cells, the firstwordline-driver circuitry being associated with the first array of thefirst memory cells and the second wordline-driver circuitry beingassociated with the second array of the first memory cells; a firstdigit line associated with the first array; a second digit lineassociated with the second array; and the first and second digit linesbeing comparatively coupled with one another through thesense-amplifier-circuitry.
 2. The integrated assembly of claim 1wherein: the first digit line is one of many digit lines of a first setof digit lines utilized to address the first memory cells; a first setof wordlines is also utilized to address the first memory cells; each ofthe first memory cells is uniquely addressed by one of the digit linesof the first set of digit lines and one of the wordlines of the firstset of wordlines; the second digit line is one of many digit lines of asecond set of digit lines utilized to address the second memory cells; asecond set of wordlines is also utilized to address the second memorycells; and each of the second memory cells is uniquely addressed by oneof the digit lines of the second set of digit lines and one of thewordlines of the second set of wordlines.
 3. The integrated assembly ofclaim 2 wherein: the wordlines of the first set of wordlines are coupledwith the first wordline-driver-circuitry which is associated only withthe wordlines of the first set of wordlines; and the wordlines of thesecond set of wordlines are coupled with the secondwordline-driver-circuitry which is associated only with the wordlines ofthe second set of wordlines.
 4. (canceled)
 5. The integrated assembly ofclaim 1 wherein the sense-amplifier-circuitry and the first and secondwordline-driver-circuitries are directly under the first and secondmemory arrays.
 6. The integrated assembly of claim 5 wherein the firstblock of sense-amplifier-circuitry and the second block ofsense-amplifier-circuitry are directly under the first and second memoryarrays; wherein the first wordline-driver-circuitry is arranged in twoor more spaced-apart blocks directly under the first and second memoryarrays; and wherein the second wordline-driver-circuitry is arranged intwo or more spaced-apart blocks directly under the first and secondmemory arrays. 7-21. (canceled)